Special Section on Immersion Lithography

Immersion Lithography

J. Micro/Nanolith. MEMS MOEMS. 3(1), 8 (Jan 01, 2004). doi:10.1117/1.1640619
History: Online February 17, 2004
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Surfacing as a strong contender to extend the limits of optical microlithography is immersion lithography. A few years ago, immersion lithography was viewed as a research topic, not a serious method for integrated circuit fabrication. In recent years however, the pace of wavelength transitions has slowed as the development of all aspects of proposed next-generation lithography (NGL) technologies (including optical materials, exposure tools, resists, sources, masks, and pellicles) has not matured at the rate required for insertion to manufacturing. In addition, the economics of lithography have started to force smaller device makers to give up hopes of staying at the very leading edge. Thus, a relatively simple extension of 193-nm lithography using water immersion to increase depth of focus (DOF) at existing apertures and to increase resolution with apertures higher than 1.0 has taken hold of the imagination of many workers in the field. Further, the search is on for optical fluids that can be used to extend 157-nm exposure tools to even finer resolution limits. This special section on immersion lithography has collected many papers from these international efforts to outline the current hot pace of development.

© 2004 Society of Photo-Optical Instrumentation Engineers

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William H. Arnold
"Immersion Lithography", J. Micro/Nanolith. MEMS MOEMS. 3(1), 8 (Jan 01, 2004). ; http://dx.doi.org/10.1117/1.1640619


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