Microelectromechanical Systems

Improvement of current distribution uniformity on substrates for microelectromechanical systems

[+] Author Affiliations
Jong-Min Lee

Columbia University, Department of Chemical Engineering, New York, New York?10027

John T. Hachman, James J. Kelly

Sandia National Laboratories, Microsystems Processing Dept., Livermore, California?94551 E-mail: jjkelly@sandia.gov

Alan C. West

Columbia University, Department of Chemical Engineering, New York, New York?10027

J. Micro/Nanolith. MEMS MOEMS. 3(1), 146-151 (Jan 01, 2004). doi:10.1117/1.1631924
History: Received Feb. 4, 2003; Revised Jul. 3, 2003; Accepted Aug. 28, 2003; Online February 17, 2004
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The employment of an insulating shield for the improvement of the current distribution on 3-in. wafer substrates is considered. Numerical analysis is used to evaluate the influence of shield shape and position on the deposition uniformity, and the simulation results are compared to experimental data for nickel deposition from a Ni sulfamate bath. The use of a shield is shown to be an effective and simple way to improve current distribution uniformity, reducing the measured disparity between the average current density and the current density at the substrate center from ∼35% to less than about 10% for the cases studied. © 2004 Society of Photo-Optical Instrumentation Engineers.

© 2004 Society of Photo-Optical Instrumentation Engineers

Citation

Jong-Min Lee ; John T. Hachman, Jr. ; James J. Kelly and Alan C. West
"Improvement of current distribution uniformity on substrates for microelectromechanical systems", J. Micro/Nanolith. MEMS MOEMS. 3(1), 146-151 (Jan 01, 2004). ; http://dx.doi.org/10.1117/1.1631924


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