Mask Pellicles

Porous silica frame for deep ultraviolet lithography

[+] Author Affiliations
D. Laurence Meixner, Rahul Ganguli, Troy Robinson, De-Yin Jeng, Mark Morris, S. Ray Chaudhuri

YTC America Incorporated, 3401 Calle Tecate, Camarillo, California?93012 E-mail: lmeixner@ytca.com

Brian J. Grenon

Grenon Consulting Incorporated, 92 Dunlop Way, Colchester, Vermont?05446

J. Micro/Nanolith. MEMS MOEMS. 3(3), 450-454 (Jul 01, 2004). doi:10.1117/1.1758949
History: Received Jan. 2, 2003; Revised May 1, 2003; Revised Aug. 22, 2003; Accepted Nov. 13, 2003; Online July 19, 2004
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Several significant technical issues are associated with the current anodized aluminum pellicle frame. These problems will become more acute as shorter wavelengths such as 193 and 157 nm become standard. For example, it is difficult to purge the pellicle space, and the nonporous nature of the aluminum frame can lead to pressure-induced film breakage during transport. In addition, the thermal expansion behavior of aluminum does not match that of the silica substrate, which can lead to pattern distortion or bending of a hard pellicle film. Proposed solutions such as a perforated silica frame or a porous Invar™ frame may address some of these issues, but a complete solution has not been forthcoming. A porous silica frame technology based on sol-gel processing may eliminate concerns associated with the lack of porosity in the aluminum frame, as well as thermal expansion mismatch problems. Several additional advantages may also be realized, including the removal of organic contaminants from inside the pellicle space, filtration of particulate contaminants, and stability under aggressive cleaning. This approach to a porous silica frame may help enable a cost-effective route to more rapid commercialization of shorter-wavelength microlithographic processes. © 2004 Society of Photo-Optical Instrumentation Engineers.

© 2004 Society of Photo-Optical Instrumentation Engineers

Citation

D. Laurence Meixner ; Rahul Ganguli ; Troy Robinson ; De-Yin Jeng ; Mark Morris, et al.
"Porous silica frame for deep ultraviolet lithography", J. Micro/Nanolith. MEMS MOEMS. 3(3), 450-454 (Jul 01, 2004). ; http://dx.doi.org/10.1117/1.1758949


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