Articles

Design and fabrication of a hybrid nanofluidic channel

[+] Author Affiliations
Gary J. Cheng, Daniel Pirzada, Prashanta Dutta

Washington State University, School of Mechanical and Materials Engineering, Pullman, Washington 99164 E-mail: dutta@mail.wsu.edu

J. Micro/Nanolith. MEMS MOEMS. 4(1), 013009 (Mar. 4, 2005). doi:10.1117/1.1869132
History: Revised Aug. 16, 2004; Mar. 4, 2005; Online March 04, 2005
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A hybrid micro-nanofluidic channel network is developed on a silicon wafer for bioanalytical applications, such as separation, concentration, and fractionation. The nanochannel is formed on the silicon wafer using surface micromachining techniques, while the microchannel is fabricated on the poly-di-methyl-siloxane utilizing soft lithography techniques. Microfluidic networks not only support the very thin wall of the nanofluidic channel, but also provide appropriate gateways for the fluid/sample flow. The thickness of the microchannels is kept below 10 μm by changing the spin rate and time during photolithography. On the other hand, nanochannel thickness is varied between 100 and 200 nm by controlling the sputtering time of the sacrificial copper layer. Electrochemical wet etching is employed to release the thin layer of copper from the silicon dioxide shell. Our etching technique demonstrates significant advantages over other existing methods, such as wet chemical etching and reactive ion etching, including relatively fast etching rate, good selectivity, less safety and environmental concerns, less monitoring and control issues, and low cost. The dimensions of our microfluidic channels are measured using a profilometer, while the nanochannel thickness is confirmed by the atomic force microscopy and scanning electron microscopy images. © 2005 Society of Photo-Optical Instrumentation Engineers.

© 2005 Society of Photo-Optical Instrumentation Engineers

Citation

Gary J. Cheng ; Daniel Pirzada and Prashanta Dutta
"Design and fabrication of a hybrid nanofluidic channel", J. Micro/Nanolith. MEMS MOEMS. 4(1), 013009 (Mar. 4, 2005). ; http://dx.doi.org/10.1117/1.1869132


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