Industrial packaging and assembly infrastructure for MOEMS

[+] Author Affiliations
Henne van Heeren

EnablingM3, Elzenlaan 154, 3319 VC Dordrecht, The Netherlands

Ayman El-Fatatry

Loughborough University, SEIC, BAE SYSTEMS, Advanced Technology Centre, Sir Denis Rooke Building, Loughborough, Leicestershire LE11 3TU, United Kingdom

Lia Paschalidou

Market Intelligence Consultant, United Kingdom

Patric Salomon

4M2C PATRIC SALOMON GmbH, Cranachstrasse 1, 12157 Berlin, Germany

J. Micro/Nanolith. MEMS MOEMS. 4(4), 041701 (November 07, 2005). doi:10.1117/1.2121367
History: Received August 16, 2004; Revised October 26, 2004; Accepted June 27, 2005; Published November 07, 2005
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In a mature industry, all elements of the supply chain are available and are more or less in balance. Mainstream technologies are defined and well supported by a chain of product differentiation companies. Those focus companies offer services ranging from consultancy to manufacturing, where subcontracting is an essential element in the industrialization. Their specialization and dedication to one or a few elements in the technology increases professionalism and efficiency. The MOEMS industry, however, is still in its growing stage. After forming many companies aimed at the development of products and the production of components and systems, we see now many companies concentrating on the delivery of services to this industry. These services are: design and engineering, foundries, assembly and packaging, processing, and design simulation software. For manufacturing suppliers and customers, the lack of industry standards and mainstream technologies are serious drawbacks. Insight into the availability and trends in technology is important to make the right choices in the field of industrialization and production. This awareness was the reason we performed a detailed study of the companies supplying commercial services in this field. This work focuses on one important part of this study: packaging and assembly. This tends to remain a bottleneck at the end of the design cycle, often delaying and sometimes preventing industrialization and commercialization. For nearly all MEMS/MOEMS products, literally everything comes together in packaging and assembly. This is the area of full integration: electrical, mechanical, optical fluidic, magnetic, etc., functionalities come together. The problems associated with the concentration of functionalities forms a big headache for the designer. Conflicting demands, of which functionality versus economics is only one, and technical hurdles have to be overcome. Besides that, packaging and assembly is by nature application-specific, and solutions are not always transferable from one product to another. However, designers can often benefit from experience from other and general available technologies. A number of companies offer packaging and assembly services for MEMS/MOEMS, and this work gives typical examples of those commercial services. The companies range from small start-ups, offering very specialized services, to large semiconductor packaging companies, having production lines for microsystem-based products. Selecting the proper packaging method may tip the scales toward a product success or failure, while it nearly always presents a substantial part of the cost of the product. This is therefore not a marginal concern, but a crucial part of the product design. We address technologies and provide sufficient levels of classification and categorization for various aspects for the technologies, in specific, and the industry, in general, to provide particularly useful insights into the activities and the developments in this market. With more than 50 companies studied and assessed, it provides an up to date account of the state of this business and its future potential.

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© 2005 Society of Photo-Optical Instrumentation Engineers


Henne van Heeren ; Ayman El-Fatatry ; Lia Paschalidou and Patric Salomon
"Industrial packaging and assembly infrastructure for MOEMS", J. Micro/Nanolith. MEMS MOEMS. 4(4), 041701 (November 07, 2005). ; http://dx.doi.org/10.1117/1.2121367

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