Articles

Evaluation of 193-nm immersion resist without topcoat

[+] Author Affiliations
Yayi Wei

Qimonda North America Corp., Advanced Lithography Development at Albany, 255 Fuller Road, Suite 118, Albany, New York 12203

Nickolay Stepanenko

Qimonda SC300 GmbH & Co., OHG,,Koenigsbruecker Strasse 180,, Dresden, Germany 01099

Antje Laessig

Qimonda SC300 GmbH & Co., OHG,,Koenigsbruecker Strasse 180,, Dresden, Germany 01099

Lars Voelkel

Qimonda SC300 GmbH & Co., OHG,,Koenigsbruecker Strasse 180,, Dresden, Germany 01099

Michael Sebald

Qimonda AG,Guenther-Scharowsky-Strasse 21,, Erlangen, Germany 91058

J. Micro/Nanolith. MEMS MOEMS. 5(3), 033002 (September 26, 2006). doi:10.1117/1.2358128
History: Received February 17, 2006; Revised June 14, 2006; Accepted June 14, 2006; Published September 26, 2006
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A production-preferred solution is 193-nm immersion resist without a topcoat. The challenge of 193-nm immersion resist is both low leaching level and high performance. We summarize the screening results of selected 193-nm immersion resists that are designed for use without top coatings. Our evaluation is divided into several phases. Leaching levels of resist samples are first tested. The leaching data are analyzed and compared to our specifications. Both binary intensity mask and alternating phase-shift mask exposures are performed to evaluate the process window, lineedge roughness, and resist pattern profile. Resist films are rinsed by deionized (DI) water prior to or after exposure, and contrast curves are measured to investigate the resist sensitivity change. The results are compared with resist systems that use developer-soluble topcoats.

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© 2006 Society of Photo-Optical Instrumentation Engineers

Topics

Water ; Scanners

Citation

Yayi Wei ; Nickolay Stepanenko ; Antje Laessig ; Lars Voelkel and Michael Sebald
"Evaluation of 193-nm immersion resist without topcoat", J. Micro/Nanolith. MEMS MOEMS. 5(3), 033002 (September 26, 2006). ; http://dx.doi.org/10.1117/1.2358128


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