Articles

Effects of surface roughness and contact pressure on wafer bonding strength using transmission laser bonding technique

[+] Author Affiliations
Ampere A. Tseng

Arizona State University, Department of Mechanical and Aerospace Engineering, Box 876106, 1711 S. Rural Rd., Tempe, Arizona 85287-6106

Jong-Seung Park

Arizona State University, Department of Mechanical and Aerospace Engineering, Box 876106, 1711 S. Rural Rd., Tempe, Arizona 85287-6106

J. Micro/Nanolith. MEMS MOEMS. 5(4), 043013 (December 08, 2006). doi:10.1117/1.2397088
History: Received March 02, 2006; Revised July 10, 2006; Accepted July 12, 2006; Published December 08, 2006
Text Size: A A A

The reliability in the wafer bonding is highly dependent on the surface conditions present on each individual wafer. An emerging wafer bonding technique, referred to as transmission laser bonding (TLB), is examined and implemented for the bonding of Pyrex glass-to-silicon wafers using a solid-state pulsed neodymium: yttrium aluminum garnet (Nd:YAG) laser. Focusing specifically on the physical attributes of surface roughness and contact pressures, we explore their relative effects on the associated bond strength. The bonding strengths of the TLB bonded specimens are quantified using a microtensile tester, whereas the surface roughness and flatness are determined by atomic force microscopy and profilometry, respectively. The tensile results indicate that with appropriate surface roughness and contact pressure, the bond strength obtained is comparable with, if not better than, those using conventional wafer bonding techniques. Both the x-ray photoelectron spectroscopy and Auger electron spectroscopy are used to facilitate the study of the bonding mechanism of the delaminated surfaces of TLB specimens by evaluating the migration and diffusion of different atoms across the bonding interface. A thermal penetration analysis is also provided to validate the findings of the bond strength and the spectroscopic evaluations.

Figures in this Article
© 2006 Society of Photo-Optical Instrumentation Engineers

Citation

Ampere A. Tseng and Jong-Seung Park
"Effects of surface roughness and contact pressure on wafer bonding strength using transmission laser bonding technique", J. Micro/Nanolith. MEMS MOEMS. 5(4), 043013 (December 08, 2006). ; http://dx.doi.org/10.1117/1.2397088


Access This Article
Sign in or Create a personal account to Buy this article ($20 for members, $25 for non-members).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging & repositioning the boxes below.

Related Book Chapters

Topic Collections

PubMed Articles
Advertisement
  • Don't have an account?
  • Subscribe to the SPIE Digital Library
  • Create a FREE account to sign up for Digital Library content alerts and gain access to institutional subscriptions remotely.
Access This Article
Sign in or Create a personal account to Buy this article ($20 for members, $25 for non-members).
Access This Proceeding
Sign in or Create a personal account to Buy this article ($15 for members, $18 for non-members).
Access This Chapter

Access to SPIE eBooks is limited to subscribing institutions and is not available as part of a personal subscription. Print or electronic versions of individual SPIE books may be purchased via SPIE.org.