Special Section on Silicon-Based MOEMS and Their Applications

New approaches for chip-to-chip interconnects: integrating porous silicon with MOEMS

[+] Author Affiliations
Da Song

University at Albany, State University of New York, College of Nanoscale Science and Engineering, 255 Fuller Road, Albany, New York 12203

Natalya Tokranova

University at Albany, State University of New York, College of Nanoscale Science and Engineering, 255 Fuller Road, Albany, New York 12203

Alison Gracias

University at Albany, State University of New York, College of Nanoscale Science and Engineering, 255 Fuller Road, Albany, New York 12203

James Castracane

University at Albany, State University of New York, College of Nanoscale Science and Engineering, 255 Fuller Road, Albany, New York 12203

J. Micro/Nanolith. MEMS MOEMS. 7(2), 021013 (April 29, 2008). doi:10.1117/1.2909279
History: Received August 03, 2007; Revised January 09, 2008; Accepted February 11, 2008; Published April 29, 2008
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We describe two types of active optical devices developed for use as free-space optical interconnects (FSOIs) for chip-to-chip communications. The design of both types of devices—membrane and freestanding structures—includes both optical and mechanical components. The optical component contains porous silicon (PSi) with customized optical properties fabricated by electrochemical etching of silicon. The mechanical part of the devices is composed of metal/nitride bimorph thermal actuators. The membrane devices form concave mirrors when actuated, and can be used to focus the incoming optical signals and correct any optical misalignment within the input/output (I/O) fabric. The freestanding devices have out-of-plane optical components, whose tilting angle is controlled by the current applied to the actuator. These devices can function as either reflectors or tunable optical filters. By incorporating the developed PSi diffractive optical element (DOE) into the freestanding structure, another type of freestanding device is realized for beamsplitting applications. Details of the fabrication, testing, and integration of these PSi-based devices are presented.

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© 2008 Society of Photo-Optical Instrumentation Engineers

Citation

Da Song ; Natalya Tokranova ; Alison Gracias and James Castracane
"New approaches for chip-to-chip interconnects: integrating porous silicon with MOEMS", J. Micro/Nanolith. MEMS MOEMS. 7(2), 021013 (April 29, 2008). ; http://dx.doi.org/10.1117/1.2909279


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