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High-accuracy correction of critical dimension errors appearing in large-scale integration fabrication processes

[+] Author Affiliations
Takayuki Abe

Nuflare Technology Inc., Marketing Department, 3-2-6 Shin-Yokohama, Kohoku-ku, Yokohama, 222-0033, Japan

Jun Yashima

Nuflare Technology Inc., Mask Drawing Equipment Development Department, 8, Shinsugita, Isogo-ku, Yokohama, Kanagawa, 235-0032, Japan

Hayato Shibata

Nuflare Technology Inc., Mask Drawing Equipment Development Department, 8, Shinsugita, Isogo-ku, Yokohama, Kanagawa, 235-0032, Japan

J. Micro/Nanolith. MEMS MOEMS. 7(2), 023006 (April 29, 2008). doi:10.1117/1.2909474
History: Received May 24, 2007; Revised December 03, 2007; Accepted December 14, 2007; Published April 29, 2008
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In our previous paper, we proposed a new method to obtain accurate pattern dimensions for correcting global critical dimension (CD) errors, which are defined as errors of CD uniformity in a region of several millimeters to several centimeters. The method is based on the pattern modulation method [a method of correcting CD errors by controlling figure sizes of large-scale integration (LSI) patterns]. An essential point of our method is to take into account the difference between the pattern density of the original LSI pattern and that of the corrected pattern (which has a pattern dimension different from original one after pattern modulation for correction) to provide an accurate correction. In this paper, we apply the proposed method to correct CD errors caused by flare and microloading effects. It is shown from numerical calculations that our method can suppress the correction error to less than 0.1nm for both cases by three iterations. It is strongly recommended that our method be used for a wide range of applications to provide the necessary CD accuracies of the future.

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© 2008 Society of Photo-Optical Instrumentation Engineers

Citation

Takayuki Abe ; Jun Yashima and Hayato Shibata
"High-accuracy correction of critical dimension errors appearing in large-scale integration fabrication processes", J. Micro/Nanolith. MEMS MOEMS. 7(2), 023006 (April 29, 2008). ; http://dx.doi.org/10.1117/1.2909474


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