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Electrical characterization of adhesive flip chip interconnects for microwave application

[+] Author Affiliations
Jong-Woong Kim

Sungkyunkwan University, School of Advanced Materials Science and Engineering, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, South Korea

Young-Chul Lee

Sungkyunkwan University, School of Advanced Materials Science and Engineering, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, South Korea

Sang-Su Ha

Sungkyunkwan University, School of Advanced Materials Science and Engineering, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, South Korea

Ja-Myeong Koo

Sungkyunkwan University, School of Advanced Materials Science and Engineering, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, South Korea

Jae-Hoon Ko

Sungkyunkwan University, School of Electrical and Computer Engineering, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, South Korea

Wansoo Nah

Sungkyunkwan University, School of Electrical and Computer Engineering, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, South Korea

Seung-Boo Jung

Sungkyunkwan University, School of Advanced Materials Science and Engineering, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, South Korea sbjung@skku.ac.kr

J. Micro/Nanolith. MEMS MOEMS. 7(2), 023007 (April 28, 2008). doi:10.1117/1.2908941
History: Received August 18, 2007; Revised December 05, 2007; Accepted December 19, 2007; Published April 28, 2008
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Microwave performance of the anisotropic conductive film (ACF) and nonconductive film (NCF) interconnects was investigated by measuring the scattering parameters (S-parameters) of the flip chip modules employing the films. To compare the accurate intrinsic microwave performance of the ACF and NCF interconnects without lossy effect of chip and substrate, a de-embedding technique was employed. The effects of two chip materials, Si and quartz (SiO2), and of the metal pattern gap between the signal line and ground plane in the coplanar waveguide (CPW) on the microwave performance of the flip chip module were also investigated. The transmission properties of the quartz were markedly improved over those of the Si chip, which was not suitable for the measurement of the S-parameters of the flip chip interconnect. Extracted impedance parameters showed that the microwave performance of the flip chip interconnect with NCF was slightly better than that of the interconnect with ACF, mainly due to the inductive effect of the conductive particle surface and capacitance of the epoxy matrix in the ACF interconnect.

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© 2008 Society of Photo-Optical Instrumentation Engineers

Citation

Jong-Woong Kim ; Young-Chul Lee ; Sang-Su Ha ; Ja-Myeong Koo ; Jae-Hoon Ko, et al.
"Electrical characterization of adhesive flip chip interconnects for microwave application", J. Micro/Nanolith. MEMS MOEMS. 7(2), 023007 (April 28, 2008). ; http://dx.doi.org/10.1117/1.2908941


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