Articles

High-resolution permanent photoresist laminate for microsystem applications

[+] Author Affiliations
Uwe Stöhr, Paul Vulto, Paul Hoppe, Gerald Urban, Holger Reinecke

University of Freiburg, Department of Microsystems Engineering, Georges-Köhler-Allee 103, D-79110 Freiburg, Germany

J. Micro/Nanolith. MEMS MOEMS. 7(3), 033009 (August 05, 2008). doi:10.1117/1.2964217
History: Received October 10, 2007; Revised April 24, 2008; Accepted June 02, 2008; Published August 05, 2008
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A new permanent dry film photoresist, TMMF S2000, is tested and evaluated for microsystem applications. The resist provides high resolution, high aspect ratios, and homogeneous resist thicknesses. Aspect ratios up to 6:1 (height:width) may be achieved for both structures and channels. Buried structures are created by covering channels with a laminated resist layer. In addition, a very fast direct wafer bonding process is developed. In this process, the resist is patterned on a wafer and directly bonded to a second wafer using pressure and heat. Both techniques enable the fabrication of microfluidic chips with high aspect ratio structures.

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© 2008 Society of Photo-Optical Instrumentation Engineers

Citation

Uwe Stöhr ; Paul Vulto ; Paul Hoppe ; Gerald Urban and Holger Reinecke
"High-resolution permanent photoresist laminate for microsystem applications", J. Micro/Nanolith. MEMS MOEMS. 7(3), 033009 (August 05, 2008). ; http://dx.doi.org/10.1117/1.2964217


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