Articles

Low-temperature wet-release process for low stiffness structures

[+] Author Affiliations
Jaibir Sharma

Indian Institute of Technology, Department of Electrical Engineering,Microelectronics and MEMS Research Laboratory, Madras, Chennai 600036, India

Amitava DasGupta

Indian Institute of Technology, Department of Electrical Engineering,Microelectronics and MEMS Research Laboratory, Madras, Chennai 600036, India

J. Micro/Nanolith. MEMS MOEMS. 7(4), 043007 (October 02, 2008). doi:10.1117/1.2990733
History: Received June 05, 2008; Accepted July 24, 2008; Published October 02, 2008
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A low-temperature wet-release process for low stiffness structures fabricated using material of low Young’s modulus has been developed and presented. The release process is described in the light of different forces that cause stiction during release. This technique is successfully demonstrated for different low stiffness structures with gold as the membrane material and positive photoresist or SiO2 as the sacrificial layer.

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© 2008 Society of Photo-Optical Instrumentation Engineers

Citation

Jaibir Sharma and Amitava DasGupta
"Low-temperature wet-release process for low stiffness structures", J. Micro/Nanolith. MEMS MOEMS. 7(4), 043007 (October 02, 2008). ; http://dx.doi.org/10.1117/1.2990733


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