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Modeling and testing of the collective effects of thermoelastic and fluid damping on silicon MEMS resonators

[+] Author Affiliations
Yun-Bo Yi

University of Denver, Department of Mechanical and Materials Engineering, Denver, Colorado 80208

Amir Rahafrooz

University of Denver, Department of Electrical and Computer Engineering, Denver, Colorado 80208

Siavash Pourkamali

University of Denver, Department of Electrical and Computer Engineering, Denver, Colorado 80208

J. Micro/Nanolith. MEMS MOEMS. 8(2), 023010 (May 04, 2009). doi:10.1117/1.3129830
History: Received January 16, 2009; Revised March 17, 2009; Accepted March 24, 2009; Published May 04, 2009
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Thermoelastic damping and fluid damping may collectively affect the resonant behaviors of silicon resonators. A finite element model is developed to predict the characteristics of the out-of-plane resonance, and the results are verified by experiments. The implementation of the perturbation method leads to an eigenvalue equation, from which the resonant frequency and the quality factor can be evaluated. The fluid damping problem is formulated by augmenting the governing equation with a linear damping term, whose coefficient is inversely determined from the experimental correlations. With the incorporation of the fluid damping term, the computational prediction achieves a good agreement with the experiment. The same method can also be extended to study the in-plane vibration of beam resonators.

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© 2009 Society of Photo-Optical Instrumentation Engineers

Citation

Yun-Bo Yi ; Amir Rahafrooz and Siavash Pourkamali
"Modeling and testing of the collective effects of thermoelastic and fluid damping on silicon MEMS resonators", J. Micro/Nanolith. MEMS MOEMS. 8(2), 023010 (May 04, 2009). ; http://dx.doi.org/10.1117/1.3129830


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