Articles

Electromechanical behavior of the curled cantilever beam

[+] Author Affiliations
Wan-Chun Chuang

National Taiwan University, Institute of Applied Mechanics, 1, Sec. 4, Roosevelt Road, Taipei, 106, Taiwan

Yuh-Chung Hu

National ILan University, Department of Mechanical and Electro-Mechanical Engineering, 1, Sec. 1, Shen-Lung Road, I-Lan, 260, Taiwan

Chi-Yuan Lee

Yuan Ze University, Department of Mechanical Engineering, Yuan Ze Fuel Cell Center, 135 Yuan-Tung Road, Chungli, Taoyuan, 320, Taiwan

Wen-Pin Shih

National Taiwan University, Department of Mechanical Engineering, 1, Sec. 4, Roosevelt Road, Taipei, 106, Taiwan

Pei-Zen Chang

National Taiwan University, Institute of Applied Mechanics, 1, Sec. 4, Roosevelt Road, Taipei, 106, Taiwan

J. Micro/Nanolith. MEMS MOEMS. 8(3), 033020 (July 13, 2009). doi:10.1117/1.3158355
History: Received August 15, 2008; Revised April 13, 2009; Accepted May 18, 2009; Published July 13, 2009
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We propose an approximate analytical solution to the pull-in voltage of a microcurled cantilever beam. The analytical model considers the realistic situations, which include stress gradient, nonideal boundary conditions, and fringing field capacitance. The proposed analytical model can be used at wafer level for extracting the Young’s modulus of the thin film of which the cantilever beam is made. The approximate analytical solution is obtained based on the Euler’s beam model and the minimum energy method. The accuracy of the proposed model is verified to be more accurate than the other published models. The model presented in this work can be used for wafer-level evaluation of the material properties through simple electrical testing and is also expected to find use in the design of microelectromechanical devices.

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© 2009 Society of Photo-Optical Instrumentation Engineers

Citation

Wan-Chun Chuang ; Yuh-Chung Hu ; Chi-Yuan Lee ; Wen-Pin Shih and Pei-Zen Chang
"Electromechanical behavior of the curled cantilever beam", J. Micro/Nanolith. MEMS MOEMS. 8(3), 033020 (July 13, 2009). ; http://dx.doi.org/10.1117/1.3158355


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