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Improved solid-state planar Ti∕Pd∕Ag∕AgCl∕KCl-gel microreference electrode by silicon cap sealing package

[+] Author Affiliations
I-Yu Huang

National Sun Yat-Sen University, Department of Electrical Engineering, Kaohsiung 80424, Taiwan

Shih-Han Wang

I-Shou University, Department of Chemical Engineering, Kaohsiung 840, Taiwan

Chi-Chih Chu

National Sun Yat-Sen University, Department of Electrical Engineering, Kaohsiung 80424, Taiwan

Chien-Tai Chiu

National Sun Yat-Sen University, Department of Electrical Engineering, Kaohsiung 80424, Taiwan

J. Micro/Nanolith. MEMS MOEMS. 8(3), 033050 (August 07, 2009). doi:10.1117/1.3196547
History: Received January 23, 2009; Revised June 08, 2009; Accepted June 18, 2009; Published August 07, 2009
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Although solid-state microreference electrodes (μREs) have been developed for electrochemical and biomedical sensing applications for more than one decade, there are very few studies devoted to improving their performance through packaging. Using planar technology and a silicon cap sealing method, we implement a packaged TiPdAgAgClKCl-gel μRE with a total dimension of only 9mm(L)×6mm(W)×1mm(H), a hundredfold less than the commercial AgAgCl reference electrode (RE). Compared with the unpackaged μRE, the presented chip-level packaged μRE demonstrates many improved characteristics, including a very stable cell potential (5-mV drift voltage in 30,000s), an approximately zero offset voltage (7mV), a very low impedance (1.50kΩ) and phase shift (8.98deg) at 1-kHz operation frequency, a very small double-layer capacitance (0.04μF), and a very high reproducibility (±3.1-mV).

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© 2009 Society of Photo-Optical Instrumentation Engineers

Citation

I-Yu Huang ; Shih-Han Wang ; Chi-Chih Chu and Chien-Tai Chiu
"Improved solid-state planar Ti∕Pd∕Ag∕AgCl∕KCl-gel microreference electrode by silicon cap sealing package", J. Micro/Nanolith. MEMS MOEMS. 8(3), 033050 (August 07, 2009). ; http://dx.doi.org/10.1117/1.3196547


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