The term EUVL has been with us for more than 15 years, but the fundamental work on the technologies needed for successful EUVL can be traced back another 10 years as soft x-ray projection lithography, before the term EUVL was adopted. Starting with the invention of multilayer reflectors for x rays in the mid-1980s through many proof-of-concept activities over the next decades, EUVL has moved from a laboratory curiosity, through the highly criticized proposals of EUVL, successful creation of EUVL mirrors, < 0.1-μm features in resist, simple working devices, and finally to the full-field prototype tools of today. These EUVL tools are creating exposures used to produce state-of-the-art levels on working integrated test circuits. In parallel, related infrastructure such as masks, blanks, electronic design automation (EDA) tools, and resists are being improved. The pace of EUVL development has increased dramatically in recent years, and it is clear that this pace will continue to accelerate as the next generation of pilot and high-volume manufacturing tools become available. Consequently, this special section on EUVL is especially timely.