Special Section on Extreme-Ultraviolet Lithography

Analysis of Coulomb and Johnsen-Rahbek electrostatic chuck performance in the presence of particles for extreme ultraviolet lithography

[+] Author Affiliations
Michael R. Sogard

Nikon Research Corporation of America, 1399 Shoreway Road, Belmont, California 94002-4107

Andrew R. Mikkelson

University of Wisconsin, Department of Mechanical Engineering, Computational Mechanics Center, Room 4150, Mechanical Engineering Building, 1513 University Avenue, Madison, Wisconsin 53706

Vasu Ramaswamy

University of Wisconsin, Department of Mechanical Engineering, Computational Mechanics Center, Room 4150, Mechanical Engineering Building, 1513 University Avenue, Madison, Wisconsin 53706

Roxann L. Engelstad

University of Wisconsin, Department of Mechanical Engineering, Computational Mechanics Center, Room 4150, Mechanical Engineering Building, 1513 University Avenue, Madison, Wisconsin 53706

J. Micro/Nanolith. MEMS MOEMS. 8(4), 041506 (November 02, 2009). doi:10.1117/1.3238518
History: Received March 06, 2009; Revised June 10, 2009; Accepted July 01, 2009; Published November 02, 2009; Online November 02, 2009
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The successful implementation of extreme ultraviolet lithography (EUVL) requires the use of an electrostatic chuck to both support and flatten the mask during scanning exposure. The EUVL Mask Standard, SEMI P37, specifies the nonflatness of the mask frontside and backside, as well as the thickness variation, to be 30 to 100 nm peak-to-valley, dependent on the class of substrate. Thus, characterizing and predicting the capability of the electrostatic chuck to reduce mask nonflatness to meet these specifications are critical issues. In this research, the ability of such chucks to deal with the presence of particles trapped between the substrate and chuck is investigated. Analytical and finite element modeling are used to identify the forces needed to fully embed or deform a particle during electrostatic chucking. Simulation results (using an elastic analysis) show that the forces generated by both Coulomb and Johnsen-Rahbek chucks should be able to sufficiently deform, or flatten, particles that are nearly 1.0 μm in size.

© 2009 Society of Photo-Optical Instrumentation Engineers

Topics

Particles ; Reticles

Citation

Michael R. Sogard ; Andrew R. Mikkelson ; Vasu Ramaswamy and Roxann L. Engelstad
"Analysis of Coulomb and Johnsen-Rahbek electrostatic chuck performance in the presence of particles for extreme ultraviolet lithography", J. Micro/Nanolith. MEMS MOEMS. 8(4), 041506 (November 02, 2009). ; http://dx.doi.org/10.1117/1.3238518


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