In the semiconductor industry, a lot of attention is being paid to economy of scale, reduction of cost, elimination of defects, and improvement of yield. These factors are similarly important for the growth of the MEMS industry. Consequently, the current imaging techniques, such as proximity printing, optical projection printing, e-beam direct write, and nanoimprint, will have to converge into optical projection printing for MEMS patterning. With projection printing we can take advantage of the productivity of 8-in. and 12-in. wafers instead of smaller wafer sizes. Projection printing also has the advantage of low defects and high product yield. To prove the point, steppers and scanners are being used at TSMC to mass-produce micromirror displays, inkjet heads, microfluidic devices, pressure sensors, accelerometers, gyroscopes, microphones, and RF switches. The evolution of projection printing can continue in a better path based on the knowledge we have gained.