Articles

Wear-ratio-based tool wear compensation for microelectrodischarge-machining of silicon through process simulation

[+] Author Affiliations
Muralidhara Rao

Indian Institute of Technology Madras, Department of Mechanical Engineering, Chennai 600036, India

Nilesh J. Vasa

Indian Institute of Technology Madras, Department of Engineering Design, Chennai 600036, India

Makaram Singaperumal

Indian Institute of Technology Madras, Department of Mechanical Engineering, Chennai 600036, India

J. Micro/Nanolith. MEMS MOEMS. 9(1), 013040 (January 21, 2010). doi:10.1117/1.3280262
History: Received May 20, 2009; Revised October 26, 2009; Accepted November 09, 2009; Published January 21, 2010; Online January 21, 2010
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A prototype microelectrodischarge machine (micro-EDM) with a piezoactuated tool feed mechanism has been developed. In micro-EDM, the tool also experiences continuous wear during machining. This necessitates a tool wear compensation technique to attain a specified depth of micromachining on the workpieces. Tool wear compensation studies are performed during micromachining of silicon wafers using a copper tool. In order to estimate the necessary tool wear compensation, an axial tool wear and micromachined hole-depth measurement technique is incorporated, and variation in wear ratio at different depths of micromachining is investigated. Process simulation of micro-EDM is also performed to estimate the tool wear compensation required to reach a predefined depth during micromachining on silicon. Results obtained by simulation for the required tool feed, depth of hole achieved corresponding to a set value, and the resulting axial tool wear are in close agreement with experimental results. A machining depth variation of about 6% with respect to the estimated depth is observed. This approach provides a process control methodology for mircromachining of semiconductor and conducting materials to predefined depth with high accuracy.

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© 2010 Society of Photo-Optical Instrumentation Engineers

Citation

Muralidhara Rao ; Nilesh J. Vasa and Makaram Singaperumal
"Wear-ratio-based tool wear compensation for microelectrodischarge-machining of silicon through process simulation", J. Micro/Nanolith. MEMS MOEMS. 9(1), 013040 (January 21, 2010). ; http://dx.doi.org/10.1117/1.3280262


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