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Full-chip characterization of compression algorithms for direct-write maskless lithography systems

[+] Author Affiliations
Vito Dai

University of California, Berkeley, California 94720

Avideh Zakhor

University of California, Berkeley, California 94720

George Cramer

University of California, Berkeley, California 94720

J. Micro/Nanolith. MEMS MOEMS. 9(1), 013055 (March 29, 2010). doi:10.1117/1.3366553
History: Received March 04, 2009; Revised July 10, 2009; Accepted February 05, 2010; Published March 29, 2010; Online March 29, 2010
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Future lithography systems must produce more dense microchips with smaller feature sizes while maintaining throughput comparable to today’s optical lithography systems. This places stringent data-handling requirements of up to 12Tbs on the design of any maskless lithography system. In past work, we have developed data-path architectures for such throughput and shown that lossless compression algorithms play a key role in such systems. We currently investigate the effectiveness of the Block C4 lossless layout compression algorithm in increasing throughput of direct-write maskless lithography systems. In particular, we characterize the compression efficiency of Block C4 on 1024×1024 blocks of select layers of two 65-nm chips: a state-of-the-art microprocessor chip and a low-density parity code chip used commonly in wireless communication applications. Overall, we have found that compression efficiency varies significantly from design to design, from layer to layer, and even within parts of the same layer. We propose a number of ways to cope with the variation of compression ratios within a layer and characterize the way each method affects the overall wafer layer throughput.

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© 2010 Society of Photo-Optical Instrumentation Engineers

Citation

Vito Dai ; Avideh Zakhor and George Cramer
"Full-chip characterization of compression algorithms for direct-write maskless lithography systems", J. Micro/Nanolith. MEMS MOEMS. 9(1), 013055 (March 29, 2010). ; http://dx.doi.org/10.1117/1.3366553


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