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Lifting angle of polyimide self-assembly surface-micromachined structure

[+] Author Affiliations
I-Yu Huang

National Sun Yat-Sen University, Department of Electrical Engineering, Kaohsiung 80424, Taiwan

Yen-Chi Lee

National Sun Yat-Sen University, Department of Electrical Engineering, Kaohsiung 80424, Taiwan

Chang-Yu Lin

National Sun Yat-Sen University, Department of Electrical Engineering, Kaohsiung 80424, Taiwan

Pin-En Ho

National Sun Yat-Sen University, Department of Electrical Engineering, Kaohsiung 80424, Taiwan

J. Micro/Nanolith. MEMS MOEMS. 9(2), 023006 (April 13, 2010). doi:10.1117/1.3385769
History: Received July 10, 2009; Revised February 21, 2010; Accepted March 01, 2010; Published April 13, 2010; Online April 13, 2010
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This study presents a polyimide (PI) self-assembly technique for developing a 3-D surface-micromachined structure. The effects of geometric factors and curing temperatures of PI elastic joints on the lifting angles of such 3-D microstructures are investigated. Under the optimized curing condition (380°C), a maximum 74-deg lifting angle of 5.2×1011kg-weight polysilicon microplate is achieved utilizing a large thermal shrinkage force of a single PI joint. Before severe cross-linkage occurred (curing at 390to400°C), the lifting angle of the thermally actuated 3-D microstructure is nearly in direct proportion to the length/width-thickness ratio of the PI joint (with linearity of 95.5%) and the difference between curing and room temperatures (with linearity of 92.3 to 97%). The PI-based self-assembly process is very suitable for mass production due to its high yield of fabrication (80 to 91.6%) and high compatibility with the present IC and MEMS manufacturing processes.

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© 2010 Society of Photo-Optical Instrumentation Engineers

Citation

I-Yu Huang ; Yen-Chi Lee ; Chang-Yu Lin and Pin-En Ho
"Lifting angle of polyimide self-assembly surface-micromachined structure", J. Micro/Nanolith. MEMS MOEMS. 9(2), 023006 (April 13, 2010). ; http://dx.doi.org/10.1117/1.3385769


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