Articles

Comparing positive and negative tone development process for printing the metal and contact layers of the 32- and 22-nm nodes

[+] Author Affiliations
Joost Bekaert, Lieve Van Look, Vincent Truffert, Frederic Lazzarino, Geert Vandenberghe

IMEC, Kapeldreef 75, 3001, Leuven, Belgium

Mario Reybrouck

FUJIFILM Electronic Materials EU, Keetberglaan 1A, 2070, Zwijndrecht, Belgium

Shinji Tarutani

FUJIFILM Corporation, Electronic Materials Research Laboratories, 4000 Kawashiri, Yoshida-Cho, Haibara-Gun, Shizuoka 421-0396, Japan

J. Micro/Nanolith. MEMS MOEMS. 9(4), 043007 (December 23, 2010). doi:10.1117/1.3524829
History: Received April 02, 2010; Revised October 14, 2010; Accepted October 21, 2010; Published December 23, 2010; Online December 23, 2010
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A strong demand exists for techniques that extend application of ArF immersion lithography. Besides techniques such as litho-friendly design, dual exposure/patterning schemes, customized illumination, alternative processing schemes are also viable candidates. One of the most promising alternative flows uses image reversal by means of a negative tone development (NTD) step with a Fujifilm solvent-based developer. Traditionally, contact and trench printing uses a dark-field mask in combination with positive tone resist and positive tone development. With NTD, the same features are printed in positive resist using light-field masks, and consequently with better image contrast. We present an overview of NTD applications, comparing the NTD performance to that of the traditional development. Experimental work is performed at a 1.35 numerical aperture, targeting the contact/metal layers of the 32- and 22-nm nodes. For contact printing, we consider both single- and dual-exposure schemes for regular arrays and 2-D patterns. For trench printing, we study 1-D, line end, and 2-D patterns. We also assess the etch capability and critical dimension uniformity performance of the NTD process. We proves the added value of NTD. It enables us to achieve a broader pitch range and/or smaller litho targets, which makes NTD attractive for the most advanced lithography applications, including double patterning.

© 2010 Society of Photo-Optical Instrumentation Engineers

Citation

Joost Bekaert ; Lieve Van Look ; Vincent Truffert ; Frederic Lazzarino ; Geert Vandenberghe, et al.
"Comparing positive and negative tone development process for printing the metal and contact layers of the 32- and 22-nm nodes", J. Micro/Nanolith. MEMS MOEMS. 9(4), 043007 (December 23, 2010). ; http://dx.doi.org/10.1117/1.3524829


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