A wafer-level vacuum packaging based on anodic bonded glass-silicon-glass triple stack with both lateral interconnections and vertical feedthroughs is presented. A z-axis gyroscope is packaged and tested to verify the packaging process. The packaged gyroscope achieved a Q factor of 26000, increased by a factor of 30 when compared to the same gyroscope without vacuum packaging. The pressure in the packaged cavity is ∼100 Pa, and the stability of the Q factor in three months is ∼3%. Experiment results indicate that the proposed wafer-level vacuum packaging is feasible and suitable for high-performance wafer-level packaged gyroscopes.