Special Section on Theory and Practice of MEMS, NEMS, and MOEMS

Wafer-level vacuum packaging with lateral interconnections and vertical feedthroughs for microelectromechanical system gyroscopes

[+] Author Affiliations
Qian Cheng Zhao

Peking University, National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Beijing 100871 China and State Key Laboratory of Transducer Technology, Chinese Academy of Sciences, Beijing 100190, China

Zhen Chuan Yang

Peking University, National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Beijing, 100871 China

Zhong Yang Guo

Peking University, National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Beijing, 100871 China

Hai Tao Ding

Peking University, National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Beijing, 100871 China

Mo Li

Peking University, National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Beijing, 100871 China

Gui Zhen Yan

Peking University, National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Beijing, 100871 China

J. Micro/Nanolith. MEMS MOEMS. 10(1), 011507 (March 25, 2011). doi:10.1117/1.3565459
History: Received July 31, 2010; Revised February 10, 2011; Accepted February 21, 2011; Published March 25, 2011; Online March 25, 2011
Text Size: A A A

A wafer-level vacuum packaging based on anodic bonded glass-silicon-glass triple stack with both lateral interconnections and vertical feedthroughs is presented. A z-axis gyroscope is packaged and tested to verify the packaging process. The packaged gyroscope achieved a Q factor of 26000, increased by a factor of 30 when compared to the same gyroscope without vacuum packaging. The pressure in the packaged cavity is ∼100 Pa, and the stability of the Q factor in three months is ∼3%. Experiment results indicate that the proposed wafer-level vacuum packaging is feasible and suitable for high-performance wafer-level packaged gyroscopes.

Figures in this Article
© 2011 Society of Photo-Optical Instrumentation Engineers (SPIE)

Citation

Qian Cheng Zhao ; Zhen Chuan Yang ; Zhong Yang Guo ; Hai Tao Ding ; Mo Li, et al.
"Wafer-level vacuum packaging with lateral interconnections and vertical feedthroughs for microelectromechanical system gyroscopes", J. Micro/Nanolith. MEMS MOEMS. 10(1), 011507 (March 25, 2011). ; http://dx.doi.org/10.1117/1.3565459


Tables

Access This Article
Sign in or Create a personal account to Buy this article ($20 for members, $25 for non-members).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging & repositioning the boxes below.

Related Journal Articles

Related Book Chapters

Topic Collections

Advertisement
  • Don't have an account?
  • Subscribe to the SPIE Digital Library
  • Create a FREE account to sign up for Digital Library content alerts and gain access to institutional subscriptions remotely.
Access This Article
Sign in or Create a personal account to Buy this article ($20 for members, $25 for non-members).
Access This Proceeding
Sign in or Create a personal account to Buy this article ($15 for members, $18 for non-members).
Access This Chapter

Access to SPIE eBooks is limited to subscribing institutions and is not available as part of a personal subscription. Print or electronic versions of individual SPIE books may be purchased via SPIE.org.