Articles

Defect reduction of high-density full-field patterns in jet and flash imprint lithography

[+] Author Affiliations
Lovejeet Singh, Kang Luo, Zhengmao Ye, Frank Xu, Gaddi Haase, David Curran, Dwayne LaBrake, Douglas Resnick, S. V. Sreenivasan

Molecular Imprints Inc., 1807-C W. Braker Lane, Austin, Texas 78758

J. Micro/Nanolith. MEMS MOEMS. 10(3), 033018 (September 14, 2011). doi:10.1117/1.3625635
History: Received May 11, 2011; Revised July 19, 2011; Accepted July 27, 2011; Published September 14, 2011; Online September 14, 2011
Text Size: A A A

Acceptance of imprint lithography for manufacturing will require demonstration that it can attain defect levels commensurate with the defect specifications of high-end memory devices. We summarize the results of defect inspections focusing on two key defect types: random nonfill defects occurring during the resist filling process and repeater defects caused by interactions with particles on the substrate. Nonfill defectivity must always be considered within the context of process throughput. The key limiting throughput step in an imprint process is resist filling time. Repeater defects typically have two main sources: mask defects and particle-related defects. Previous studies have indicated that soft particles tend to cause nonrepeating defects. Hard particles, on the other hand, can cause either resist plugging or mask damage. We use an Imprio 500 20– wafer per hour development tool to study both defect types. By carefully controlling the volume of inkjetted resist, optimizing the drop pattern, and controlling the resist fluid front during spreading, fill times of 1.5 s are achieved with nonfill defect levels of ∼1.2/cm2. Longevity runs were used to study repeater defects, and a nickel contamination was identified as the key source of particle-induced repeater defects.

Figures in this Article
© 2011 Society of Photo-Optical Instrumentation Engineers (SPIE)

Citation

Lovejeet Singh ; Kang Luo ; Zhengmao Ye ; Frank Xu ; Gaddi Haase, et al.
"Defect reduction of high-density full-field patterns in jet and flash imprint lithography", J. Micro/Nanolith. MEMS MOEMS. 10(3), 033018 (September 14, 2011). ; http://dx.doi.org/10.1117/1.3625635


Tables

Access This Article
Sign in or Create a personal account to Buy this article ($20 for members, $25 for non-members).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging & repositioning the boxes below.

Related Book Chapters

Topic Collections

Advertisement
  • Don't have an account?
  • Subscribe to the SPIE Digital Library
  • Create a FREE account to sign up for Digital Library content alerts and gain access to institutional subscriptions remotely.
Access This Article
Sign in or Create a personal account to Buy this article ($20 for members, $25 for non-members).
Access This Proceeding
Sign in or Create a personal account to Buy this article ($15 for members, $18 for non-members).
Access This Chapter

Access to SPIE eBooks is limited to subscribing institutions and is not available as part of a personal subscription. Print or electronic versions of individual SPIE books may be purchased via SPIE.org.