Special Section on Directed Self-Assembly

Lithography assisted self-assembly of contact holes on 300-mm wafer scale

[+] Author Affiliations
Sander F. Wuister

ASML, De Run 6501, Veldhoven, Netherlands

Jo Finders

ASML, De Run 6501, Veldhoven, Netherlands

Emiel Peeters

Philips Research Europe, 5656 AE Eindhoven, Netherlands

Chris van Heesch

Philips Research Europe, 5656 AE Eindhoven, Netherlands

J. Micro/Nanolith. MEMS MOEMS. 11(3), 031304 (Jul 12, 2012). doi:10.1117/1.JMM.11.3.031304
History: Received November 29, 2011; Revised May 8, 2012; Accepted May 16, 2012
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Abstract.  Self-assembly of block copolymers is a potential technique to be used in the fabrication of microelectronic devices. In some cases, the self-assembly is directed by means of an additional technique, e.g. photolithography. This paper studies the impact of ArFi-lithography on the properties of the polymer after the directed assembly. Placement, critical dimension and critical dimension uniformity of the features are analyzed and discussed and compared to an integrated circuit application according to the international technology roadmap for semiconductors roadmap.

© 2012 Society of Photo-Optical Instrumentation Engineers

Citation

Sander F. Wuister ; Jo Finders ; Emiel Peeters and Chris van Heesch
"Lithography assisted self-assembly of contact holes on 300-mm wafer scale", J. Micro/Nanolith. MEMS MOEMS. 11(3), 031304 (Jul 12, 2012). ; http://dx.doi.org/10.1117/1.JMM.11.3.031304


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