Special Section on Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS III

Packaging of MEMS and MOEMS for harsh environments

[+] Author Affiliations
Julian Kähler

Institute of Semiconductor Technology, TU Braunschweig, Hans-Sommer-Str. 66, 38106 Braunschweig, Germany

Andrej Stranz

Institute of Semiconductor Technology, TU Braunschweig, Hans-Sommer-Str. 66, 38106 Braunschweig, Germany

Andreas Waag

Institute of Semiconductor Technology, TU Braunschweig, Hans-Sommer-Str. 66, 38106 Braunschweig, Germany

Erwin Peiner

Institute of Semiconductor Technology, TU Braunschweig, Hans-Sommer-Str. 66, 38106 Braunschweig, Germany

J. Micro/Nanolith. MEMS MOEMS. 11(2), 021202 (May 07, 2012). doi:10.1117/1.JMM.11.2.021202
History: Received August 15, 2011; Revised November 14, 2011; Accepted November 16, 2011
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Abstract.  A method for die-attach based on sintering of micro- and nano-silver-particles, which is stable in harsh environments, was described. A modified flip-chip bonder providing high placement accuracy was used for precise pick and place die-attach. Components of sensors designed for data logging during deep drilling, i.e., a MEMS vibration sensor and a MOEMS pressure sensor, were assembled and tested at temperatures up to 250°C. Shear tests of bonded devices were performed before and after temperature load. Bonded silicon-on-insulator Wheatstone bridges and GaP-PD were tested by temperature cycling (50 cycles from 100°C up to 250°C).

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© 2012 Society of Photo-Optical Instrumentation Engineers

Citation

Julian Kähler ; Andrej Stranz ; Andreas Waag and Erwin Peiner
"Packaging of MEMS and MOEMS for harsh environments", J. Micro/Nanolith. MEMS MOEMS. 11(2), 021202 (May 07, 2012). ; http://dx.doi.org/10.1117/1.JMM.11.2.021202


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