Packaging of MEMS and MOEMS for harsh environments

Julian Kähler; Andrej Stranz; Andreas Waag; Erwin Peiner

doi:10.1117/1.JMM.11.2.021202

7 May 2012 Packaging of MEMS and MOEMS for harsh environments

Julian Kähler, Andrej Stranz, Andreas Waag, Erwin Peiner

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 11, Issue 2, 021202 (May 2012). https://doi.org/10.1117/1.JMM.11.2.021202

Abstract

A method for die-attach based on sintering of micro- and nano-silver-particles, which is stable in harsh environments, was described. A modified flip-chip bonder providing high placement accuracy was used for precise pick and place die-attach. Components of sensors designed for data logging during deep drilling, i.e., a MEMS vibration sensor and a MOEMS pressure sensor, were assembled and tested at temperatures up to 250°C. Shear tests of bonded devices were performed before and after temperature load. Bonded silicon-on-insulator Wheatstone bridges and GaP-PD were tested by temperature cycling (50 cycles from 100°C up to 250°C).

Citation Download Citation

Julian Kähler, Andrej Stranz, Andreas Waag, and Erwin Peiner "Packaging of MEMS and MOEMS for harsh environments," Journal of Micro/Nanolithography, MEMS, and MOEMS 11(2), 021202 (7 May 2012). https://doi.org/10.1117/1.JMM.11.2.021202

Published: 7 May 2012

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