7 August 2012 50-keV electron multibeam mask writer for the 11-nm HP node: first results of the proof-of-concept electron multibeam mask exposure tool
Christof Klein, Hans Loeschner, Elmar Platzgummer
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Abstract
First results obtained with IMS Nanofabrication's 50-keV proof-of-concept electron multibeam mask exposure tool (eMET POC) are presented. The eMET POC was designed from scratch to meet the requirements of the 11-nm half-pitch node and already features the same column as future high volume manufacturing (HVM) tools. All exposures shown in this paper were the result of 262,144 beams of 20 nm beam size working in parallel demonstrating the capability of IMS's multibeam technology. An alpha tool is scheduled for 2014, followed by a beta tool in 2015 and first-generation HVM tools in 2016.
© 2012 Society of Photo-Optical Instrumentation Engineers (SPIE) 0091-3286/2012/$25.00 © 2012 SPIE
Christof Klein, Hans Loeschner, and Elmar Platzgummer "50-keV electron multibeam mask writer for the 11-nm HP node: first results of the proof-of-concept electron multibeam mask exposure tool," Journal of Micro/Nanolithography, MEMS, and MOEMS 11(3), 031402 (7 August 2012). https://doi.org/10.1117/1.JMM.11.3.031402
Published: 7 August 2012
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Cited by 17 scholarly publications.
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KEYWORDS
Photomasks

Scanning electron microscopy

Nanofabrication

Semiconducting wafers

Silicon

Calibration

Lithography

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