Regular Articles

Experimental investigation of three-dimensional interconnect processing wafers

[+] Author Affiliations
Yi-sha Ku

Industrial Technology Research Institute, Center for Measurement Standards, 321 Kuang Fu Road, Section 2, Hsinchu, Taiwan 300

Po-Yi Chang

Industrial Technology Research Institute, Center for Measurement Standards, 321 Kuang Fu Road, Section 2, Hsinchu, Taiwan 300

Chris Shen

Electronics and Optoelectronics Research Institute, Industrial Technology Research Institute, 195 Chung Hsing Road, Section 4, Chutung, Hsinchu, Taiwan 310

J. Micro/Nanolith. MEMS MOEMS. 11(4), 043002 (Oct 01, 2012). doi:10.1117/1.JMM.11.4.043002
History: Received March 26, 2012; Revised August 8, 2012; Accepted August 24, 2012
Text Size: A A A

Abstract.  The use and enhancement of a semi-automated wafer characterization tool, a dual channel capacitive sensor module, is demonstrated by implementing a new measurement algorithm for metallization process control. This tool is capable of measuring the deposited metal film thickness induced bow and warpage in a full wafer surface scan. The nondestructive solution can measure Cu metal film thickness with a total measurement uncertainty of 0.18 μm (1σ). The stress conversion map can be obtained based on the modified Stoney’s formula and the capacitance-displacement technique. A wafer thinning process was also performed to characterize the warpage/bow of 8-in. wafers, which continues to increase as wafer thicknesses are reduced from 725 to 300 μm. There was a linear relationship between the wafer warpage and bow and the square of the inverse of the thickness. Metrology results from actual 3-D interconnect processing wafers are presented.

Figures in this Article
© 2012 Society of Photo-Optical Instrumentation Engineers

Citation

Yi-sha Ku ; Po-Yi Chang and Chris Shen
"Experimental investigation of three-dimensional interconnect processing wafers", J. Micro/Nanolith. MEMS MOEMS. 11(4), 043002 (Oct 01, 2012). ; http://dx.doi.org/10.1117/1.JMM.11.4.043002


Access This Article
Sign in or Create a personal account to Buy this article ($20 for members, $25 for non-members).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging & repositioning the boxes below.

Related Book Chapters

Topic Collections

PubMed Articles
Advertisement
  • Don't have an account?
  • Subscribe to the SPIE Digital Library
  • Create a FREE account to sign up for Digital Library content alerts and gain access to institutional subscriptions remotely.
Access This Article
Sign in or Create a personal account to Buy this article ($20 for members, $25 for non-members).
Access This Proceeding
Sign in or Create a personal account to Buy this article ($15 for members, $18 for non-members).
Access This Chapter

Access to SPIE eBooks is limited to subscribing institutions and is not available as part of a personal subscription. Print or electronic versions of individual SPIE books may be purchased via SPIE.org.