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Novel automated microassembly mechanism based on on-chip actuators

[+] Author Affiliations
Yuan Xue

Ryerson University, Department of Mechanical and Industrial Engineering, 350 Victoria Street, Toronto, Ontario M5B 2K3, Canada

Siyuan He

Ryerson University, Department of Mechanical and Industrial Engineering, 350 Victoria Street, Toronto, Ontario M5B 2K3, Canada

J. Micro/Nanolith. MEMS MOEMS. 12(1), 013003 (Jan 17, 2013). doi:10.1117/1.JMM.12.1.013003
History: Received August 30, 2012; Revised November 26, 2012; Accepted December 11, 2012
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Abstract.  The development of a novel automated microassembly mechanism based on on-chip actuators is described. The assembly mechanism utilizes repulsive-force actuators to flip surface-micromachined two-dimensional structures out-of-plane and assemble them in a vertical position. The assembly mechanism is suitable for wafer-level multidevice batch assembly without external interference. Prototypes were fabricated using the PolyMUMPs surface micromachining technology, then tested. The strength of the assembled structures in terms of withstanding external acceleration was calculated and experimentally measured. The measured results showed the assembly strength of 7 g for prototype 1 and 8 to 11 g for prototype 2.

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© 2013 Society of Photo-Optical Instrumentation Engineers

Citation

Yuan Xue and Siyuan He
"Novel automated microassembly mechanism based on on-chip actuators", J. Micro/Nanolith. MEMS MOEMS. 12(1), 013003 (Jan 17, 2013). ; http://dx.doi.org/10.1117/1.JMM.12.1.013003


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