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Microassembly process to fabricate a microoptoelectromechanical systems scanning mirror with angular vertical comb electrodes

[+] Author Affiliations
Min-Ho Jun

Gwangju Institute of Science and Technology, Graduate School of Information and Mechatronics, 1 Oryong-dong, Buk-gu, Gwangju 500-712, Republic of Korea

Seunghwan Moon

Gwangju Institute of Science and Technology, Graduate School of Information and Mechatronics, 1 Oryong-dong, Buk-gu, Gwangju 500-712, Republic of Korea

Jong-Hyun Lee

Gwangju Institute of Science and Technology, Graduate School of Information and Mechatronics, 1 Oryong-dong, Buk-gu, Gwangju 500-712, Republic of Korea

Gwangju Institute of Science and Technology, Department of Medical System Engineering, 1 Oryong-dong, Buk-gu, Gwangju 500-712, Republic of Korea

J. Micro/Nanolith. MEMS MOEMS. 12(1), 013006 (Feb 01, 2013). doi:10.1117/1.JMM.12.1.013006
History: Received July 24, 2012; Revised December 14, 2012; Accepted January 10, 2013
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Abstract.  We present a simple microassembly technology that easily realizes angular vertical combs for a microoptoelectromechanical systems scanner. The scanner is composed of a device section with comb electrodes and a tilting section with four tapered pillars. During the microassembly process, two tilting pillars push down the levers so that the comb electrodes connected with the micromirror are tilted; the other two alignment pillars fit into the alignment holes of the device section, which is fabricated via a deep reactive ion etching process of a silicon-on-insulator wafer. The tilting section is fabricated through a series of anisotropic wet etching of a (100) silicon wafer and patterning processes of SU-8, which is robust enough to ensure repeatability of the initial tilted angles of the movable comb electrodes. The pull-in investigation function is analyzed through a numerical estimation to obtain a large scan angle with stable behavior. The fabricated microscanner shows an optical scan angle of up to 4.23 deg at 90 V in the static mode and stable actuation of up to 11.3 deg at a resonant frequency of 2.87 kHz. The roughness of the mirror surface is less than 10 nm, which will have a negligible effect on imaging quality. The initial tilted angles in the microassembly process showed high repeatability within 10% error.

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© 2013 Society of Photo-Optical Instrumentation Engineers

Citation

Min-Ho Jun ; Seunghwan Moon and Jong-Hyun Lee
"Microassembly process to fabricate a microoptoelectromechanical systems scanning mirror with angular vertical comb electrodes", J. Micro/Nanolith. MEMS MOEMS. 12(1), 013006 (Feb 01, 2013). ; http://dx.doi.org/10.1117/1.JMM.12.1.013006


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