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Scalability limits of Talbot lithography with plasma-based extreme ultraviolet sources

[+] Author Affiliations
Serhiy Danylyuk

RWTH Aachen University and JARA—Fundamentals of Future Information Technology, Chair for the Technology of Optical Systems, Steinbachstrasse 15, 52074 Aachen, Germany

Peter Loosen

RWTH Aachen University and JARA—Fundamentals of Future Information Technology, Chair for the Technology of Optical Systems, Steinbachstrasse 15, 52074 Aachen, Germany

Klaus Bergmann

Fraunhofer Institute for Laser Technology, Steinbachstrasse 15, 52074 Aachen, Germany

Hyun-su Kim

RWTH Aachen University and JARA—Fundamentals of Future Information Technology, Chair for the Experimental Physics of EUV, Steinbachstrasse 15, 52074 Aachen, Germany

Larissa Juschkin

RWTH Aachen University and JARA—Fundamentals of Future Information Technology, Chair for the Experimental Physics of EUV, Steinbachstrasse 15, 52074 Aachen, Germany

J. Micro/Nanolith. MEMS MOEMS. 12(3), 033002 (Jul 08, 2013). doi:10.1117/1.JMM.12.3.033002
History: Received March 14, 2013; Revised May 22, 2013; Accepted June 11, 2013
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Abstract.  Lithography has been faced with a challenge to bring resolution down to the 10-nm level. One of the promising approaches for such ultra-high-resolution printing is self-imaging Talbot lithography with extreme ultraviolet (EUV) radiation. However, as the size of structures on the mask approaches the wavelength of the radiation, diffraction influence needs to be evaluated precisely to estimate the achievable resolution and quality of the patterns. Here, the results of finite-difference time-domain simulations of the diffraction on EUV transmission masks in dependence to the period (pitch) of the mask are presented with the aim to determine the resolution that can be realistically achieved with the EUV Talbot lithography. The modeled experimental setup is utilizing partially coherent EUV radiation with the wavelength of 10.9 nm from Xe/Ar discharge plasma EUV source and Ni/Nb-based amplitude transmission mask. The results demonstrate that the method can be used to produce patterns with resolution down to 7.5-nm half-pitch with 21 mask demagnification utilizing achromatic Talbot effect and transverse electric (TE)-polarized light.

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© 2013 Society of Photo-Optical Instrumentation Engineers

Citation

Serhiy Danylyuk ; Peter Loosen ; Klaus Bergmann ; Hyun-su Kim and Larissa Juschkin
"Scalability limits of Talbot lithography with plasma-based extreme ultraviolet sources", J. Micro/Nanolith. MEMS MOEMS. 12(3), 033002 (Jul 08, 2013). ; http://dx.doi.org/10.1117/1.JMM.12.3.033002


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