25 September 2013 Performance of silicon-on-insulator multiuser MEMS processes–based electrothermally actuated silicon microgrippers
Sujatha Lakshminarayanan, Siddhartha Goutham Murali, Saravanan Mani, Selvakumar Varatharajan Subramani
Author Affiliations +
Abstract
Recently, microgrippers are finding more importance in the field of tissue engineering and microassembly in semiconductor electronics. Large force and, hence, large displacement, low power, and low temperature are the essential features to be considered during the design of the microgrippers. The electrical and mechanical behaviors of electrothermally actuated silicon microgrippers are presented. The effect of increasing the flexure length and the cold arm area to improve the displacement is discussed. These microgrippers are normally of the open type, in which the arms have an initial open gap of 20 μm, and they move away from each other with the applied voltage. The displacement of each arm is observed to be 24 μm for the applied voltage of 10 V. The response time of the device is less than 5 ms, and the maximum power dissipation is 110 mW. The displacement of the microgrippers can be increased with increased flexure length and cold arm length with short extended arms. This structure also shows lower stress.
© 2013 Society of Photo-Optical Instrumentation Engineers (SPIE) 0091-3286/2013/$25.00 © 2013 SPIE
Sujatha Lakshminarayanan, Siddhartha Goutham Murali, Saravanan Mani, and Selvakumar Varatharajan Subramani "Performance of silicon-on-insulator multiuser MEMS processes–based electrothermally actuated silicon microgrippers," Journal of Micro/Nanolithography, MEMS, and MOEMS 12(3), 033020 (25 September 2013). https://doi.org/10.1117/1.JMM.12.3.033020
Published: 25 September 2013
Lens.org Logo
CITATIONS
Cited by 2 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Silicon

Microelectromechanical systems

Actuators

Resistance

Connectors

Photomasks

Video

RELATED CONTENT

Measured forces and displacements of integrated force arrays
Proceedings of SPIE (September 15 1995)
Micro-shutter developments for IR applications
Proceedings of SPIE (August 19 2008)
Chip-level three-dimensional assembling of microsystems
Proceedings of SPIE (March 10 1999)
Suspended thermal oxide trench isolation for SCS MEMS
Proceedings of SPIE (October 05 1998)
Integration and packaging of MEMS relays
Proceedings of SPIE (April 10 2000)

Back to Top