Special Section on Metrology and Inspection for 3-D Integrated Circuits and Interconnects

Macroinspection methodology for through silicon via array in three-dimensional integrated circuit

[+] Author Affiliations
Yoshihiko Fujimori

Nikon Corporation, Instruments Company, 471 Nagaodai-cho, Sakae-ku, Yokohama City, Kanagawa 244-8533, Japan

Takashi Tsuto

Nikon Corporation, Core Technology Center, 471 Nagaodai-cho, Sakae-ku, Yokohama City, Kanagawa 244-8533, Japan

Hiroyuki Tsukamoto

Nikon Corporation, Core Technology Center, 471 Nagaodai-cho, Sakae-ku, Yokohama City, Kanagawa 244-8533, Japan

Kazuya Okamoto

Nikon Corporation, Core Technology Center, 471 Nagaodai-cho, Sakae-ku, Yokohama City, Kanagawa 244-8533, Japan

Osaka University, Center for Advanced Science and Innovation, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan

Kyoichi Suwa

Nikon Corporation, 471 Nagaodai-cho, Sakae-ku, Yokohama City, Kanagawa 244-8533, Japan

J. Micro/Nanolith. MEMS MOEMS. 13(1), 011204 (Jan 29, 2014). doi:10.1117/1.JMM.13.1.011204
History: Received July 16, 2013; Revised November 29, 2013; Accepted December 20, 2013
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Abstract.  We are developing a new macroinspection technology for through silicon via (TSV) process wafers. We present new simulation results obtained with a fine TSV model and new optics. The optical system includes not only diffraction optics, but also polarization optics, by which we can detect changes in the profile (cross-sectional shape) of repeated patterns by detecting changes in the polarization status of reflected light. We confirmed the performance of the methodology by optical simulation using a model of via patterns with 1 μm diameter and 10 μm depth as a typical intermediate-interconnect-level TSV.

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© 2014 Society of Photo-Optical Instrumentation Engineers

Citation

Yoshihiko Fujimori ; Takashi Tsuto ; Hiroyuki Tsukamoto ; Kazuya Okamoto and Kyoichi Suwa
"Macroinspection methodology for through silicon via array in three-dimensional integrated circuit", J. Micro/Nanolith. MEMS MOEMS. 13(1), 011204 (Jan 29, 2014). ; http://dx.doi.org/10.1117/1.JMM.13.1.011204


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