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Comparative study of various release methods for gold surface micromachining

[+] Author Affiliations
Akshdeep Sharma

Central Electronics Engineering Research Institute, Council of Scientific and Industrial Research, Sensors and Nanotechnology Group, Pilani, Rajasthan, India

Prachi Jhanwar

Central Electronics Engineering Research Institute, Council of Scientific and Industrial Research, Sensors and Nanotechnology Group, Pilani, Rajasthan, India

Deepak Bansal

Central Electronics Engineering Research Institute, Council of Scientific and Industrial Research, Sensors and Nanotechnology Group, Pilani, Rajasthan, India

Amit Kumar

Central Electronics Engineering Research Institute, Council of Scientific and Industrial Research, Sensors and Nanotechnology Group, Pilani, Rajasthan, India

Maninder Kaur

Central Electronics Engineering Research Institute, Council of Scientific and Industrial Research, Sensors and Nanotechnology Group, Pilani, Rajasthan, India

Shilpi Pandey

Central Electronics Engineering Research Institute, Council of Scientific and Industrial Research, Sensors and Nanotechnology Group, Pilani, Rajasthan, India

Prem Kumar

Central Electronics Engineering Research Institute, Council of Scientific and Industrial Research, Sensors and Nanotechnology Group, Pilani, Rajasthan, India

Dinesh Kumar

Kurukshetra University, Department of Electronics Science, Kurukshetra, Haryana, India

Kamaljit Rangra

Central Electronics Engineering Research Institute, Council of Scientific and Industrial Research, Sensors and Nanotechnology Group, Pilani, Rajasthan, India

J. Micro/Nanolith. MEMS MOEMS. 13(1), 013005 (Feb 05, 2014). doi:10.1117/1.JMM.13.1.013005
History: Received August 13, 2013; Revised December 26, 2013; Accepted January 3, 2014
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Abstract.  A comparison of dry and wet release methods for surface micromachining of metallic structures, such as RF MEMS switches, test structures, bridges, and cantilevers is presented. The dry release process is optimized by varying the concentration of O2 and CF4 plasma and RF power. The plasma ashing of the sacrificial layer typically results in damage to metallic structures or stress-related deformation due to rise in temperature (>80°C). A wet release process using critical point drying (CPD) has been investigated to realize gold-electroplated structures with reduced residual stress. The CPD, being a low-temperature (31.1°C) process, is more suitable for compliant structures without any deformation.

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© 2014 Society of Photo-Optical Instrumentation Engineers

Citation

Akshdeep Sharma ; Prachi Jhanwar ; Deepak Bansal ; Amit Kumar ; Maninder Kaur, et al.
"Comparative study of various release methods for gold surface micromachining", J. Micro/Nanolith. MEMS MOEMS. 13(1), 013005 (Feb 05, 2014). ; http://dx.doi.org/10.1117/1.JMM.13.1.013005


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