Alexander Starikov is an independent consultant DBA I & I Consulting, Palo Alto, California. He received his PhD in physics from the University of Rochester, Rochester, New York (’83). While with Advanced Lithography Systems Development at IBM Corp., East Fishkill, New York, he established rule-based 2-D OPC (’88), certifiably accurate alignment and overlay metrology and performance testing ('88-'94), SEM based overlay metrology (’92). In California since ‘95, he managed Alignment/Metrology Engineering at Ultratech, leaving for Intel Corp. in ’98, where he put into production model-based OPC, pioneered lithography metrology and inspection. He is a SPIE member (’84) and founded Device and Process Integration for Microelectronics Manufacture (2002-3), chaired Metrology, Inspection and Process Control for Microlithography (2011–2013), authored 40+ papers, a book chapter, and seven patents.