Fabrication of three-dimensional and submicrometer-scaled microstructures based on metal contact printing and silicon bulk machining

Kuo-Lun Kao; Cho-Wei Chang; Yung-Chun Lee

doi:10.1117/1.JMM.13.2.023008

21 May 2014 Fabrication of three-dimensional and submicrometer-scaled microstructures based on metal contact printing and silicon bulk machining

Kuo-Lun Kao, Cho-Wei Chang, Yung-Chun Lee

Author Affiliations +

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 13, Issue 2, 023008 (May 2014). https://doi.org/10.1117/1.JMM.13.2.023008

Abstract

This paper describes a method that contains a series of processes for producing three-dimensional (3-D) microstructures with a feature size in the submicrometer scale. It starts from using a metal contact printing lithography to pattern a thin metal film on the surface of a (100) silicon substrate. The metal film has a hole-array pattern with a hole diameter ranging from 300 nm to 800 nm and is used as an etching mask for silicon bulk machining to create concave pyramid-shaped surface microstructures. Using this bulk-machined silicon substrate as a template, polymer 3-D microstructures are replicated on top of a silicon dioxide (SiO₂ ) layer. Finally, through a dry etching process, 3-D microstructures with a profile similar to the replicated polymer microstructures are formed on the SiO ₂ layer. Potential applications of these fabricated SiO ₂ microstructures in the light-emitting diode industry will be addressed.

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Kuo-Lun Kao, Cho-Wei Chang, and Yung-Chun Lee "Fabrication of three-dimensional and submicrometer-scaled microstructures based on metal contact printing and silicon bulk machining," Journal of Micro/Nanolithography, MEMS, and MOEMS 13(2), 023008 (21 May 2014). https://doi.org/10.1117/1.JMM.13.2.023008

Published: 21 May 2014

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KEYWORDS

Silicon

3D microstructuring

Metals

Silicon films

Printing

Sapphire

Polymers

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