In the first step, substrates coated with an underlayer, NCI-NIL-01 (Nissan Chemical Industries, Ltd., Chiba, Japan), were prepared.12 The purpose of the underlayer or transfer layer is to improve adhesion and to provide a mask for subsequent etch process. In the second step, imprints were carried out on an Imprio 100® (Molecular Imprints Inc., Austin, Texas) S-FIL tool installed at the University of Texas at Austin. A quartz template with 80-nm lines and 180-nm spaces was fabricated by the University of Texas at Austin. The template was pretreated with a fluorinated surface treatment (tridecafluoro-1,1,2,2-tetrahydro octyldimethylchlorosilane from Gelest Inc., Morrisville, Pennsylvania) to improve the template release.13,14 In the third step, a etch was carried out on a reactive ion etcher, Oxford Plasmalab 80 plus (Oxford Instruments, Abingdon, United Kingdom) to remove the excess epoxy-Si-12 layer. The etch ratio of epoxy-Si-12 was measured to enable a timed process that led to the correct etch depth. In the last step, an etch was carried out to break through the organic layer. An SEM (Zeiss Neon 40) was used to measure the stack thicknesses and etch depths.