Self-aligned double-patterning layout decomposition for two-dimensional random metals for sub-10-nm node design

Yongchan Ban; David Z. Pan

doi:10.1117/1.JMM.14.1.011004

4 December 2014 Self-aligned double-patterning layout decomposition for two-dimensional random metals for sub-10-nm node design

Yongchan Ban, David Z. Pan

Author Affiliations +

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 14, Issue 1, 011004 (December 2014). https://doi.org/10.1117/1.JMM.14.1.011004

Abstract

Self-aligned double patterning (SADP) is popularly in production use for one-dimensional-type dense patterns with good pitch control in NAND Flash memory applications and the fin layer patterning of FinFET devices, but it is still challenging to apply SADP to two-dimensional (2-D) random metal patterns. We describe the SADP layout decomposition methods for complex 2-D layouts. The SADP for complex logic metals consists of a two mask approach using a core (mandrel) mask and a trim mask. This paper describes methods for automatically choosing and optimizing the manufacturability of base core mask patterns, generating assist core patterns, and optimizing trim mask patterns to accomplish high quality layout decomposition in the SADP process. Our technique is validated with 22-nm node industrial standard cells and logic designs, which can be applicable to sub-10-nm node design. Experimental results show that our proposed layout decomposition for SADP effectively decomposes many challenging 2-D layouts.

Citation Download Citation

Yongchan Ban and David Z. Pan "Self-aligned double-patterning layout decomposition for two-dimensional random metals for sub-10-nm node design," Journal of Micro/Nanolithography, MEMS, and MOEMS 14(1), 011004 (4 December 2014). https://doi.org/10.1117/1.JMM.14.1.011004

Published: 4 December 2014

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