19 December 2014 Effect of measurement error budgets and hybrid metrology on qualification metrology sampling
Matthew J. Sendelbach, Niv Sarig, Koichi Wakamoto, Hyang Kyun (Helen) Kim, Paul K. Isbester, Masafumi Asano, Kazuto Matsuki, Carmen Osorio, Chas Archie
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Abstract
Until now, metrologists had no statistics-based method to determine the sampling needed for an experiment before the start that accuracy experiment. We show a solution to this problem called inverse total measurement uncertainty (TMU) analysis, by presenting statistically based equations that allow the user to estimate the needed sampling after providing appropriate inputs, allowing him to make important “risk versus reward” sampling, cost, and equipment decisions. Application examples using experimental data from scatterometry and critical dimension scanning electron microscope tools are used first to demonstrate how the inverse TMU analysis methodology can be used to make intelligent sampling decisions and then to reveal why low sampling can lead to unstable and misleading results. One model is developed that can help experimenters minimize sampling costs. A second cost model reveals the inadequacy of some current sampling practices—and the enormous costs associated with sampling that provides reasonable levels of certainty in the result. We introduce the strategies on how to manage and mitigate these costs and begin the discussion on how fabs are able to manufacture devices using minimal reference sampling when qualifying metrology steps. Finally, the relationship between inverse TMU analysis and hybrid metrology is explored.
© 2014 Society of Photo-Optical Instrumentation Engineers (SPIE) 0091-3286/2014/$25.00 © 2014 SPIE
Matthew J. Sendelbach, Niv Sarig, Koichi Wakamoto, Hyang Kyun (Helen) Kim, Paul K. Isbester, Masafumi Asano, Kazuto Matsuki, Carmen Osorio, and Chas Archie "Effect of measurement error budgets and hybrid metrology on qualification metrology sampling," Journal of Micro/Nanolithography, MEMS, and MOEMS 13(4), 041414 (19 December 2014). https://doi.org/10.1117/1.JMM.13.4.041414
Published: 19 December 2014
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CITATIONS
Cited by 3 scholarly publications and 2 patents.
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KEYWORDS
Metrology

Transmission electron microscopy

Statistical analysis

Semiconducting wafers

Error analysis

Manufacturing

Scatterometry

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