20 January 2015 Fabrication and characterization of an all optically addressed micromirror array
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Abstract
We describe the fabrication process for an optically addressed adaptive optics array. The device consists of a micromirror array cascaded directly on wafer fused gallium arsenide (GaAs)-gallium phosphide (GaP) photodiodes. Optically addressing a photodiode generates a photocurrent which in turn causes a voltage drop across the cascaded mirror via an integrated thin film resistor. This architecture allows parallel optical addressing of individual elements without the need for wire bonding each pixel, which can enable higher density segmented type arrays. We first describe a fabrication process for releasing a free-standing array of low stress SixN micromirrors on an indium phosphide (InP) support substrate. We then present a process for transferring GaAs p-i-n photodiodes on a transparent GaP support substrate using a specially designed wafer fusion fixture. The two samples when stacked together and electrically connected via a specially formulated and patterned semiconductive SU-8 resist form the final device. We report mirror displacements of up to 500 nm using this technique while requiring an optical signal as low as 150  μW.
© 2015 Society of Photo-Optical Instrumentation Engineers (SPIE) 0091-3286/2015/$25.00 © 2015 SPIE
Vaibhav Mathur, Shiva R. Vangala, and Jed Khoury "Fabrication and characterization of an all optically addressed micromirror array," Journal of Micro/Nanolithography, MEMS, and MOEMS 14(1), 015501 (20 January 2015). https://doi.org/10.1117/1.JMM.14.1.015501
Published: 20 January 2015
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KEYWORDS
Resistors

Micromirrors

Mirrors

Photodiodes

Semiconducting wafers

Gallium arsenide

Actuators

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