Microelectromechanical Systems (MEMS)

Planar architecture for microstrip interfaced packaging of coplanar-waveguide-based radio frequency microelectromechanical system switches

[+] Author Affiliations
Shailendra Singh, Cheemalamarri Venkata Narasimha Rao

Indian Space Research Organization (ISRO), Space Applications Center, Jodhpur Tekra, Ambawadi Vistar P.O., Ahmedabad 380015, India

Malalahalli Sreenivasamurthy Giridhar, Rifqul Islam

Indian Space Research Organization (ISRO), Laboratory for Electro Optic Systems, 1st Cross, 1st Stage, Peenya Industrial Area, Bangalore 560058, India

Sangam Bhalke

Gallium Arsenide Enabling Technology Center, Vignyana Kancha Post, Hyderabad 560069, India

J. Micro/Nanolith. MEMS MOEMS. 14(1), 015002 (Feb 27, 2015). doi:10.1117/1.JMM.14.1.015002
History: Received September 20, 2014; Accepted January 28, 2015
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Abstract.  This paper describes the architecture of microstrip (MS) interfaced packaging of a coplanar-waveguide (CPW)-based radio frequency microelectromechanical systems (RF MEMS) switch in a hermetic metal-ceramic RF package. The switch is integrated along with CPW to MS (CPW-MS) transitions within the package itself. This makes the MS interfaced packaged switch module readily mountable on MS based RF boards and subsystems. The CPW-MS transition for the package was designed as a separate off-chip entity on an alumina substrate and utilizes via hole. The integrated three-dimensional model of the package consisting of the RF MEMS switch and the transitions was simulated using high frequency structure simulator. The realized module shows an insertion loss of 0.2 and 1.1 dB at 100 MHz and 7 GHz, respectively. The measured isolation is better than 60 dB at 100 MHz and 30 dB at 7 GHz. The return loss is better than 15 dB up to 7 GHz. The estimated packaging and transitioning loss is 0.5 dB at 5 GHz. This packaging architecture is a planar solution for the MS interfaced packaging of CPW based RF MEMS switches for designers who do not have access to high-end technologies, such as zero-level packaging, through silicon via or low temperature co-fired ceramics.

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© 2015 Society of Photo-Optical Instrumentation Engineers

Citation

Shailendra Singh ; Malalahalli Sreenivasamurthy Giridhar ; Cheemalamarri Venkata Narasimha Rao ; Sangam Bhalke and Rifqul Islam
"Planar architecture for microstrip interfaced packaging of coplanar-waveguide-based radio frequency microelectromechanical system switches", J. Micro/Nanolith. MEMS MOEMS. 14(1), 015002 (Feb 27, 2015). ; http://dx.doi.org/10.1117/1.JMM.14.1.015002


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