3 March 2015 Fabrication of self-aligned, nanoscale, complex oxide varactors
Richard X. Fu, Ryan C. Toonen, Samuel G. Hirsch, Mathew P. Ivill, Melanie W. Cole, Kenneth E. Strawhecker
Author Affiliations +
Abstract
Applications in ferroelectric random access memory and superparaelectric devices require the fabrication of ferroelectric capacitors at the nanoscale that exhibit extremely small leakage currents. To systematically study the material-size dependence of ferroelectric varactor performance, arrays of parallel-plate structures have been fabricated with nanoscale dielectric diameters. Electron beam lithography and inductively coupled plasma dry etching have been used to fabricate arrays of ferroelectric varactors using top electrodes as a self-aligned etch mask. Parallel-plate test structures using RF-sputtered Ba0.6Sr0.4TiO3 thin-films were used to optimize the fabrication process. Varactors with diameters down to 20 nm were successfully fabricated. Current-voltage (I-V) characteristics were measured to evaluate the significance of etch-damage and fabrication quality by ensuring low leakage currents through the structures.
© 2015 Society of Photo-Optical Instrumentation Engineers (SPIE) 1932-5150/2015/$25.00 © 2015 SPIE
Richard X. Fu, Ryan C. Toonen, Samuel G. Hirsch, Mathew P. Ivill, Melanie W. Cole, and Kenneth E. Strawhecker "Fabrication of self-aligned, nanoscale, complex oxide varactors," Journal of Micro/Nanolithography, MEMS, and MOEMS 14(1), 013508 (3 March 2015). https://doi.org/10.1117/1.JMM.14.1.013508
Published: 3 March 2015
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KEYWORDS
Etching

Nanolithography

Thin films

Complex oxides

Electrodes

Electron beam lithography

Argon

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