Special Section on Control of Integrated Circuit Patterning Variance Part 1: Metrology, Process Monitoring, and Control of Critical Dimension

Patterning critical dimension control for advanced logic nodes

[+] Author Affiliations
Bertrand Le-Gratiet, Jean De-Caunes, Maxime Gatefait, Auguste Lam, Alain Ostrovsky, Jonathan Planchot, Vincent Farys, Julien Ducoté, Marc Mikolajczak, Vincent Morin, Nicolas Chojnowski, Frank Sundermann, Alice Pelletier, Regis Bouyssou, Cedric Monget, Jean Damien Chapon, Bastien Orlando, Laurene Babaud, Emek Yesilada, Anna Szucs, Jean-Christophe Michel, Onintza Ros Bengoechea, Pascal Gouraud

STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex, France

Celine Lapeyre, Latifa Desvoivres

CEA, LETI, MINATEC Campus, 17 Rue des Martyrs, F-38054 Grenoble Cedex 9, France

J. Micro/Nanolith. MEMS MOEMS. 14(2), 021103 (Apr 10, 2015). doi:10.1117/1.JMM.14.2.021103
History: Received August 7, 2014; Accepted March 6, 2015
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Abstract.  Patterning process control has undergone major evolutions over the last few years. Critical dimension, focus, and overlay control require deep insight into process-variability understanding to be properly apprehended. Process setup is a complex engineering challenge. In the era of mid k1 lithography (>0.6), process windows were quite comfortable with respect to tool capabilities, therefore, some sources of variability were, if not ignored, at least considered as negligible. The low k1 patterning (<0.4) era has broken down this concept. For the most advanced nodes, engineers need to consider such a wide set of information that holistic processing is often mentioned as the way to handle the setup of the process and its variability. The main difficulty is to break down process-variability sources in detail and be aware that what could have been formerly negligible has become a very significant contributor requiring control down to a fraction of a nanometer. The scope of this article is to highlight that today, engineers have to zoom deeper into variability. Even though process tools have greatly improved their capabilities, diminishing process windows require more than tool-intrinsic optimization. Process control and variability compensations are major contributors to success. Some examples will be used to explain how complex the situation is and how interlinked processes are today.

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© 2015 Society of Photo-Optical Instrumentation Engineers

Citation

Bertrand Le-Gratiet ; Jean De-Caunes ; Maxime Gatefait ; Auguste Lam ; Alain Ostrovsky, et al.
"Patterning critical dimension control for advanced logic nodes", J. Micro/Nanolith. MEMS MOEMS. 14(2), 021103 (Apr 10, 2015). ; http://dx.doi.org/10.1117/1.JMM.14.2.021103


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