In order to fabricate very fine contact fingers with a prismatic profile, a process chain was developed based on NIL, evaporation, and lift-off processes. For the master structure, v-grooves realized in silicon using photolithography and alkaline etching were used. PDMS stamps were replicated from these silicon masters and a NIL process was conducted using a bilayer resist system consisting of a Laromer PO84F resist from BASF, which is patterned by NIL, and a lift-off resist (LOR) layer beneath (MicroChem LOR10B). After the patterning of the imprint resist, the residual layer is opened using plasma etching; then, the LOR layer is opened in a development step (using AZ400K developer and deionized water in ratio 1:4). Next, the evaporation is conducted, where the sample is mounted in a way so that defined angles of the contact finger result. Finally, the lift-off process is conducted using the organic solvent N-Methyl-2-pyrrolidone (NMP). Figure 5 illustrates the different stages of this process chain, showing that the principle of realizing prismatic shapes and just fine fingers was successfully demonstrated. However, it can be seen that an unwanted thin metal layer was deposited besides the contact finger. This effect results from an excessive opening of the LOR layer prior to the evaporation process. Thus, in a next step, the development of the LOR layer has to be optimized in order to eliminate this effect. Furthermore, the tip of the contact finger is not as sharp as it has been before the lift-off process. This can be attributed to the use of ultrasonic cleaning to promote the removal of the LOR layer. As a consequence, either the power has to be reduced or megasonic cleaning might be applied.