Microfabrication

Bonding of copper surface in ambient air using propylene carbonate as passivation layer

[+] Author Affiliations
Zhiyuan Zhu

Peking University, National Key Laboratory of Science and Technology on Micro/Nano Fabrication, No. 5 Yiheyuan Road, Haidian District, Beijing 100871, China

Georgia Institute of Technology, School of Chemical and Biomolecular Engineering, 311 Ferst Drive NW, Atlanta, Georgia 30332, United States

Min Yu, Yufeng Jin

Peking University, National Key Laboratory of Science and Technology on Micro/Nano Fabrication, No. 5 Yiheyuan Road, Haidian District, Beijing 100871, China

Oluwadamilola Phillips, Lisha Liu

Georgia Institute of Technology, School of Chemical and Biomolecular Engineering, 311 Ferst Drive NW, Atlanta, Georgia 30332, United States

J. Micro/Nanolith. MEMS MOEMS. 14(3), 034504 (Sep 25, 2015). doi:10.1117/1.JMM.14.3.034504
History: Received February 18, 2015; Accepted August 28, 2015
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Abstract.  Bonding of a copper surface in a nonvacuum environment has been studied for the purpose of reducing manufacturing costs. Cu-Cu bonding in ambient air is demonstrated by using propylene carbonate (PPC) as a passivation layer. The decomposition of the PPC passivation layer during bonding would protect the copper surface from oxidation by providing a shielding gas atmosphere between the copper surface and the air. Further, the PPC passivation layer would also overcome the degradation of copper surface during storage in the atmosphere.

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© 2015 Society of Photo-Optical Instrumentation Engineers

Citation

Zhiyuan Zhu ; Min Yu ; Oluwadamilola Phillips ; Lisha Liu and Yufeng Jin
"Bonding of copper surface in ambient air using propylene carbonate as passivation layer", J. Micro/Nanolith. MEMS MOEMS. 14(3), 034504 (Sep 25, 2015). ; http://dx.doi.org/10.1117/1.JMM.14.3.034504


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