Bonding of copper surface in ambient air using propylene carbonate as passivation layer

Zhiyuan Zhu; Min Yu; Oluwadamilola Phillips; Lisha Liu; Yufeng Jin

doi:10.1117/1.JMM.14.3.034504

25 September 2015 Bonding of copper surface in ambient air using propylene carbonate as passivation layer

Zhiyuan Zhu, Min Yu, Oluwadamilola Phillips, Lisha Liu, Yufeng Jin

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 14, Issue 3, 034504 (September 2015). https://doi.org/10.1117/1.JMM.14.3.034504

Abstract

Bonding of a copper surface in a nonvacuum environment has been studied for the purpose of reducing manufacturing costs. Cu-Cu bonding in ambient air is demonstrated by using propylene carbonate (PPC) as a passivation layer. The decomposition of the PPC passivation layer during bonding would protect the copper surface from oxidation by providing a shielding gas atmosphere between the copper surface and the air. Further, the PPC passivation layer would also overcome the degradation of copper surface during storage in the atmosphere.

Citation Download Citation

Zhiyuan Zhu, Min Yu, Oluwadamilola Phillips, Lisha Liu, and Yufeng Jin "Bonding of copper surface in ambient air using propylene carbonate as passivation layer," Journal of Micro/Nanolithography, MEMS, and MOEMS 14(3), 034504 (25 September 2015). https://doi.org/10.1117/1.JMM.14.3.034504

Published: 25 September 2015

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