Special Section on Control of Integrated Circuit Patterning Variance, Part 2: Image Placement, Device Overlay, and Critical Dimension

Placement error in directed self-assembly of block copolymers for contact hole application

[+] Author Affiliations
Shayma Bouanani, Céline Lapeyre

STMicroelectronics, 850 Rue Jean Monnet, 38926 Crolles Cedex, France

CEA-LETI, MINATEC Campus, 17 Rue des Martyrs, 38054 Grenoble, France

Raluca Tiron, Sandra Bos, Ahmed Gharbi, Patricia Pimenta Barros, Jérôme Hazart

CEA-LETI, MINATEC Campus, 17 Rue des Martyrs, 38054 Grenoble, France

Frédéric Robert, Alain Ostrovsky, Cédric Monget

STMicroelectronics, 850 Rue Jean Monnet, 38926 Crolles Cedex, France

J. Micro/Nanolith. MEMS MOEMS. 15(2), 021407 (Apr 27, 2016). doi:10.1117/1.JMM.15.2.021407
History: Received October 19, 2015; Accepted April 5, 2016
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Abstract.  Directed self-assembly (DSA) of block copolymers has shown interesting results for contact hole application, as a vertical interconnection access for CMOS sub-10 nm technology. The control of critical dimension uniformity (CDU), defectivity, and placement error (PE) is challenging and depends on multiple processes and material parameters. This paper reports the work done using the 300-mm pilot line available in materials to integrate the DSA process on contact and via level patterning. In the first part, a reliable methodology for PE measurement is defined. By tuning intrinsic edge detection parameters on standard reference images, the working window is determined. The methodology is then implemented to analyze the experimental data. The impact of the planarization process on PE and the importance of PE as a complement of CDU and hole open yield for process window determination are discussed.

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© 2016 Society of Photo-Optical Instrumentation Engineers

Citation

Shayma Bouanani ; Raluca Tiron ; Sandra Bos ; Ahmed Gharbi ; Patricia Pimenta Barros, et al.
"Placement error in directed self-assembly of block copolymers for contact hole application", J. Micro/Nanolith. MEMS MOEMS. 15(2), 021407 (Apr 27, 2016). ; http://dx.doi.org/10.1117/1.JMM.15.2.021407


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