Lithography

Photolithography reaches 6 nm half-pitch using extreme ultraviolet light

[+] Author Affiliations
Daniel Fan, Yasin Ekinci

Paul Scherrer Institut, Laboratory for Micro and Nanotechnology, Villigen-PSI 5232, Switzerland

J. Micro/Nanolith. MEMS MOEMS. 15(3), 033505 (Aug 01, 2016). doi:10.1117/1.JMM.15.3.033505
History: Received May 11, 2016; Accepted July 12, 2016
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Abstract.  Extreme ultraviolet interference lithography records the interference pattern of two diffracted, coherent light beams, where the pattern resolution is half the diffraction grating resolution. The fabrication of diffraction grating masks by e-beam lithography is restricted by the electron proximity effect and pattern transfer limitations into diffraction efficient materials. By patterning HSQ lines at a relaxed pitch to avoid the electron proximity effect, depositing conformal iridium via atomic layer deposition, followed by ion milling the top and bottom iridium and HSQ removal, we fabricated iridium diffraction gratings at double the line spacing of the original HSQ lines. Line/space patterns of 6-nm half-pitch patterns were achieved using these masks, marking a new record resolution in photolithography.

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© 2016 Society of Photo-Optical Instrumentation Engineers

Citation

Daniel Fan and Yasin Ekinci
"Photolithography reaches 6 nm half-pitch using extreme ultraviolet light", J. Micro/Nanolith. MEMS MOEMS. 15(3), 033505 (Aug 01, 2016). ; http://dx.doi.org/10.1117/1.JMM.15.3.033505


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