17 August 2016 Influence of template fill in graphoepitaxy directed self-assembly
Author Affiliations +
Abstract
Directed self-assembly (DSA) of block copolymers (BCP) is considered a promising patterning approach for the 7-nm node and beyond. Specifically, a graphoepitaxy process using a cylindrical phase BCP may offer an efficient solution for patterning randomly distributed contact holes with subresolution pitches, such as found in via and cut mask levels. In any graphoepitaxy process, the pattern density impacts the template fill (local BCP thickness inside the template) and may cause defects due to over- or underfilling of the template. In order to tackle this issue thoroughly, the parameters that determine template fill and the influence of template fill on the resulting pattern should be investigated. Using three process flow variations (with different template surface energy), template fill is experimentally characterized as a function of pattern density and film thickness. The impact of these parameters on template fill is highly dependent on the process flow, and thus prepattern surface energy. Template fill has a considerable effect on the pattern transfer of the DSA contact holes into the underlying layer. Higher fill levels give rise to smaller contact holes and worse critical dimension uniformity. These results are important for DSA-aware design and show that fill is a crucial parameter in graphoepitaxy DSA.
© 2016 Society of Photo-Optical Instrumentation Engineers (SPIE) 1932-5150/2016/$25.00 © 2016 SPIE
Jan Doise, Joost P. Bekaert, Boon Teik Chan, Sung Eun Hong, Guanyang Lin, and Roel Gronheid "Influence of template fill in graphoepitaxy directed self-assembly," Journal of Micro/Nanolithography, MEMS, and MOEMS 15(3), 031603 (17 August 2016). https://doi.org/10.1117/1.JMM.15.3.031603
Published: 17 August 2016
Lens.org Logo
CITATIONS
Cited by 9 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Directed self assembly

Polymethylmethacrylate

Atomic force microscopy

Critical dimension metrology

System on a chip

Etching

Optical lithography

Back to Top