Microelectromechanical Systems (MEMS)

Ultraclean wafer-level vacuum-encapsulated silicon ring resonators for timing and frequency references

[+] Author Affiliations
George Xereas

McGill University, Department of Electrical and Computer Engineering, 3480 University Street, Room 633, Montreal, Quebec H3A 0E9, Canada

Vamsy P. Chodavarapu

University of Dayton, Department of Electrical and Computer Engineering, Kettering Laboratories 452 300 College Park, Dayton, Ohio 45469, United States

J. Micro/Nanolith. MEMS MOEMS. 15(3), 035004 (Sep 09, 2016). doi:10.1117/1.JMM.15.3.035004
History: Received June 4, 2016; Accepted August 10, 2016
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Abstract.  We present the design and development of breath-mode silicon ring resonators fabricated using a commercial pure-play microfabrication process that provides ultraclean wafer-level vacuum-encapsulation. The micromechanical resonators are fabricated in MEMS integrated design for inertial sensors process that is developed by Teledyne DALSA Semiconductor Inc. The ring resonators are designed to operate with a relatively low DC polarization voltage, starting at 5 V, while providing a high frequency-quality factor product. We study the quality of the vacuum packaging using an automated testing setup over an extended time period. We study the effect of motional resistance on the performance of MEMS resonators. The fabricated devices had a resonant frequency of 10 MHz with the quality factor exceeding 8.4×104.

© 2016 Society of Photo-Optical Instrumentation Engineers

Citation

George Xereas and Vamsy P. Chodavarapu
"Ultraclean wafer-level vacuum-encapsulated silicon ring resonators for timing and frequency references", J. Micro/Nanolith. MEMS MOEMS. 15(3), 035004 (Sep 09, 2016). ; http://dx.doi.org/10.1117/1.JMM.15.3.035004


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